Recent Technological Advances in Financial Market Infrastructure in Asean3: Cross-Border Settlement Infrastructure Forum - Paperback-Fast Shipping
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Recent Technological Advances in Financial Market Infrastructure in Asean3: Cross-Border Settlement Infrastructure Forum – Paperback-Fast Shipping

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by
Asian Development Bank (Author)

This report identifies and examines six key technologies that are transforming fundamental financial market infrastructure and will serve as a springboard for the technological advancement of financial market infrastructure in the region.

This report ascertains the most current status of technology adoption by Cross-Border Settlement Infrastructure Forum member organizations. They include central securities depositories and central banks in the Association of Southeast Asian Nations (ASEAN) plus the People’s Republic of China, Japan, and the Republic of Korea (collectively known as ASEAN+3) of Pages: 104Dimensions: 0.28 x 11 x 8.5 INPublication Date: August 30, 2022

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